With the lightweight and miniaturized development in electronics, communication and transportation industries, the problem of heat dissipation with high energy density is becoming more and more prominent, such as inverter conversion of electric vehicle, heat dissipation of PLC chip and high-power LED searchlight, which will generate an enormous amount of heat in a very small volume. The traditional thermal conductive materials copper and aluminum are difficult to meet the requirements, and the silver with best thermal conduction and heat dissipation cannot be industrialized due to its high cost. Therefore, a product that can exert the thermal conductivity of copper and heat dissipation of aluminum is an ideal material to solve the problem of heat dissipation for the high energy density.
The thickness of copper layer, and the tooth height, width and clearance of aluminum layer is simulated for the copper clad aluminum composite radiator independently developed by our company by the numerical simulation. The highpower copper clad aluminum composite radiator is prepared by the semi-melt rolling process of our company.
Its main features are as follows:
The copper clad aluminum composite radiator makes full use of the advantages to exert the thermal conductivity of copper and export the heat of the heat source.
It fully exerts the advantages of excellent heat dissipation performance and light weight of aluminum, to not only realizethe miniaturization of high energy density, but also realize the lightweight of heat dissipation system.
It realizes the metallurgical bonding between copper and aluminum, and there is not anythermal contact resistance between copper and aluminum, which reduces the heat transfer interface and greatly improves the heat dissipation efficiency of the system.
Patent number: ZL201010300694.2 (invention patent)