Characteristics and investment prospects of copper-aluminum communication substrates
In recent years, Chinese steel enterprises have continuously enhanced their sense of innovation and increased their investment in research and development of copper-aluminum communication substrate materials, but there is still a gap compared with some international steel enterprises. The independence, synergy, systematization, stability and continuity of technological innovation in the steel industry are still insufficient, and the supply of technology still cannot fully meet the development needs of the industry. Some core technologies have not been mastered, and they have not gotten rid of the role of core technology followers. At present, the localization rate of large-scale metallurgical equipment can reach more than 90%, but key and core technologies still rely on imports. Therefore, in the future for a long time, Chinese steel enterprises still need to strengthen their sense of innovation, strengthen innovation systems and mechanisms, increase R&D investment, and improve their innovation capabilities.
What are the characteristics of copper-aluminum communication substrates?
1. Copper-aluminum communication substrates have low cost and lower specific gravity: Compared with lightweight composite products, pure copper can save at least 60% of the cost, and the specific gravity is 37% to 40% of pure copper.
2. Excellent processability of copper-aluminum communication substrates: It has better bending performance than copper conductors of the same specifications and is easy to process. Due to the high interface bonding strength, copper and aluminum will not delaminate during shearing, stamping and bending.
3. Copper-aluminum communication substrates have good thermal conductivity: They are processed into strips of different thicknesses through cold rolling. They are oxygen-free metallurgical composite materials, so there is no heat transfer contact resistance, and the heat transfer performance of copper and aluminum is very good.
4. Copper-aluminum communication substrates have excellent electrical conductivity: The electrical conductivity reaches more than 90% of T2 conductors, which is a good choice to replace pure copper conductors.
5. The production width of copper-aluminum communication substrates reaches 1000 mm, and the current main thicknesses are 0.8 mm and 1.0 mm, which can be widely used in various fields.
Analysis of investment prospects of copper-aluminum communication substrate industry
After years of development, my country's copper-aluminum communication substrate industry has made great achievements and has become one of the world's major producers and exporters of copper-aluminum communication substrates. The production level, product quality, and economic benefits of my country's copper-aluminum communication substrates have been greatly improved, and the goal of modern industry has been gradually realized.
The upstream of copper-aluminum communication substrate is mainly copper and aluminum. The substrate material is mainly composed of aluminum core and copper cladding. Copper has good conductivity and good corrosion resistance, while aluminum has low cost and light weight. When used for high-frequency wires and high-current conduction, the conductivity is basically the same as that of pure copper conductors. The downstream industries of copper-aluminum communication substrate are mainly electronics, automobiles, energy, electricity, petrochemicals, metallurgy, machinery and other industrial fields. The substrate material is a new type of layered composite material developed in the power and industrial power industries in recent years. It is a high-performance composite conductor.
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