What are the difficulties in making copper-aluminum communication substrates?
The technology of copper-aluminum communication substrates is constantly improving, but at this stage, the production process of aluminum substrates still faces many problems. The editor of Luoyang Tongyi Metal Materials Development Co., Ltd. will briefly introduce the technical problems that aluminum substrates still face in the production process. Existing copper-aluminum communication substrates include Invar alloys, bee sting alloys, W, Mo, Al, Cu, etc., which can partially meet the above requirements. Invar is an iron-cobalt-nickel alloy, and Kovar is an iron-nickel alloy with good processing performance and low thermal expansion coefficient, but poor thermal conductivity. Mo and W have low thermal expansion coefficients, much higher thermal conductivity than Invar and Kovar, and high strength and hardness, so Mo and W are widely used in the power semiconductor industry. However, Mo and W are expensive, difficult to process, poor weldability, high density, and much lower thermal conductivity than pure Cu, so further application is limited. Cu and Al have good thermal conductivity, but too large thermal expansion coefficients, which are prone to thermal stress problems. The metal substrate in front of you refers to a copper-aluminum communication substrate composed of a metal plate, an insulating dielectric layer, and copper (or aluminum) foil.
What are the difficulties in making copper-aluminum communication substrates?
(1) Oxidation treatment of aluminum plate: strong degreasing washing (sodium hydroxide) - dilute nitric acid neutralization - rough (aluminum surface forms a honeycomb shape) - oxidation (3um) - each process must ensure quality. Otherwise, it will affect the adhesion of the aluminum substrate.
(2) The aluminum surface cannot be wiped during the entire production process, and aluminum, moisture and other pollution cannot be touched by hand, otherwise it will affect the adhesion of the aluminum substrate.
(3) The insulation layer of the aluminum substrate must be clean and dry. Small impurities affect the pressure resistance performance, and moisture is easy to form a layer.
(4) The protective film must be flat and there must be no gaps or bubbles. Otherwise, during the processing of the track plate, the aluminum plate will be corroded by drugs, discolored and blackened.
Selection criteria for copper-aluminum communication substrates
When selecting substrate materials, the electrical properties of the substrate materials must be considered first, namely the insulation resistance, arc resistance, penetration strength, etc. of the substrate. Secondly, the mechanical properties, namely the shear strength and hardness of the printed circuit board, must be considered. The price and manufacturing cost of the copper-aluminum communication substrate must also be considered.
The structural composition and characteristics of copper-aluminum communication substrates
The copper-aluminum communication substrate refers to a copper-aluminum communication substrate made of metal plates, insulating dielectric layers, and copper foils. Copper-aluminum communication substrates have excellent thermal properties, processing properties, electromagnetic shielding properties, dimensional stability, magnetic properties, and versatility, and are widely used in electronic components and integrated circuit support materials and power electronic devices such as heat sinks, such as rectifiers, thyristors, and power modules.
The role of copper-aluminum communication substrates
The packaging substrate is an important component of electronic packaging and is a bridge between the chip and the external circuit. The substrate has the following functions in the software package: Realize the current and signal transmission between the chip and the outside world. Mechanical protection and support of the chip, which is the main method for the chip to dissipate heat to the outside world. Spatial conversion between the chip and the external circuit. From a material perspective, commonly used packaging substrates include metal substrates, ceramic substrates, and organic substrates.
This website supports IPv6 | Privacy Policy | www.300.cn | SEO
Copyright 2024 Luoyang Copper Metal Materials Development Co., Ltd.
